www.picinternational.net
Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by launching PIC International, a global conference dedicated to this industry.
Attendees at the inaugural PIC International conference will hear industry-leading insiders delivering more than 30 presentations spanning six sectors.
PIC International provides comprehensive coverage of all aspects of this industry, from basic research to materials, equipment, packaging, and the incorporation of chips in data centres and optical networks. So whether you focus on system integration, developing and manufacturing components, financing this sector, or providing the materials and equipment needed to support this industry, PIC International is your must-attend conference for 2016.?
Six key themes
- wher should the laser go?
- Driving deployment of PICs in datacentres
- Increasing the capability of optical networks
- What's the role of the foundry?
- Do we have the tools for designing, making, packaging and testing PICs?
- A question of material: InP, silicon, or something else?
Presentations 2016 (committed to date)
wher should the laser go?
- High speed photonic integrated receivers for 100G and above
William Ring, CEO and President - BB Photonics
- Heterogeneous integration: creating photonic circuits for advanced systems-in-package
Gregory Fish, CTO - Aurrion
- Excelling in the efficiency of lasers formed on silicon
Shinji Matsuo - NTT Photonics Lab
- Title TBC
Fang Wu, CTO - ArtIC Photonics
- Turning to quantum dot lasers for terabit communication?
Hamid Arabzadeh, Chairman, President and CEO – Ranovus
Driving deployment of PICs in datacentres
- Using CMOS photonics to support next-generation cloud computing, data center and high performance computing connectivity
Arlon Martin, Senior Director, Marketing - Mellanox Technologies
- Constructing very large scale PICs for data centres
Di Liang, Research Scientist - HP
- Towards cost-effective 100 Gb/s optical transceivers
Jason Orcutt, Research Staff Member – IBM
- Creating the building blocks for better datacentres Craig Thompson, Director of Strategic Marketing - Finisar
Increasing the capability of optical networks
- How can silicon photonics benefit optical access deployment? An example from the FABULOUS EU Project
Silvio Abrate, Head of Applied Photonics - ISMB
- Photonic circuits enabling multi-dimensional IM/DD systems for short reach optical interconnects
David Plant, Professor in the Department of Electrical and Computer Engineering – McGill University
- Silicon photonics in optical networking – yesterday's hype, today's reality, tomorrow's vision
Harald Bock, CTO Technology Strategy- Coriant
What’s the role of the foundry?
- LioniX: Aid the growth of photonics with the TriPleX integrated optics platform
René Heideman, CTO and Co-founder - LioniX
- Accelerating photonic ASICs development
Katarzyna?awniczuk, JePPIX Coordinator - JePPIX
- Can foundries underpin the success of the PIC?
Samuel Wang, VP, Optoelectronics - Global Communication Semiconductors
- Title TBC
Luc Augustin, CTO - Smart Photonics
- Imec’s flexible, state-of-the-art 50Gb/s silicon photonics platform overview Philippe Absil, PT Unit, 3D and Optical Technologies Department Director - IMEC
Do we have the tools for designing, making, packaging and testing PICs?
- Bringing first-time-right design to silicon photonics
Sean Anderson, Hardware Engineer - Silicon Photonics - CISCO
- Taking a close, damage-free look at the channels on a silicon photonics chip
Stefano Grillanda, Postdoctoral Researcher - Politecnico di Milano
- Overview of the current status of photonic and electronic design tools and flows
TwanKorthorst, CEO - PhoeniX Software
A question of material: InP, silicon, or something else?
- Surveying silicon photonics: Identifying strengths and weaknesses
Thomas Collins, Chief Technology Officer, Co-founder at Caliopa, Huawei
- InP and silicon: a strong combination for integration of photonics and electronics
Meint Smit, Professor of Photonic Integration - TU Eindhoven
- Selecting materials for PIC production
Ronald Broeke, General Manager - Bright Photonics
- A bright future for germanium-on-insulator wafers?
Vincent Reboud , Research Engineer - CEA-Leti
- Hybrid and heterogeneous PICs for high performance applications
- Martijn Heck, Associate Professor - Aarhus University
- Title TBC
Martin Guy, CTO & Strategic Marketing, TeraXion
Click here to view the full agenda
The venue for this two day conference is the Sheraton Brussels Airport Hotel, in Belgium on 1st-2nd March 2016.
Further information is available on the PIC International website at: www.picinternational.net or by calling +44 (0)24 7671 8970.
For logos, images and further details on this release please contact Adam Richardson at [email protected]
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