ESI's Most Extensible Laser Micromachining Platform Delivers Efficient Manufacturing for Consum
source:ESI
release:Johnny
keywords: laser ESI Electro Scientific Industries
Time:2015-07-16
The new platform addresses challenges faced by manufacturers in the fast-changing consumer electronics segment wher they cope with new materials, new technologies and evolving consumer expectations. Meanwhile, there is relentless pressure to reduce costs, meet quality requirements and achieve high-volume high-yield production. The JadeTM platform is the first laser micromachining platform capable of meeting all these diverse requirements, offering unprecedented levels of versatility and cost-efficient operation.
"Production requirements in consumer electronics are constantly changing with new materials and features that require a range of laser micromachining processes that can be delivered quickly and at an attractive cost of ownership," said
The JadeTM platform is designed to provide contract and consumer electronics manufacturers with a smarter manufacturing option through the use of extendable and configurable stages, lasers, and automation. The base platform can be configured with multiple laser and optics options as well as a range of add-on options including pre- and post-inspection, metrology and advanced alignment automation. All configurations use a common user interface to reduce training time.
This flexibility means that a JadeTM platform can address multiple marking, cutting, and drilling applications in a responsive and cost-effective manner, improving the useful lifespan of the tool and significantly lowering overall cost of ownership for our customers. The JadeTM platform continues ESI's commitment to reliability, responsive local support in
Availability
The JadeTM Series of platforms are available now in
about ESI
ESI creates technology solutions using laser light to transform materials in ways that allow industrial designers and process engineers to differentiate their consumer electronics, wearable devices, and semiconductor circuits to gain market advantage. Our laser-based manufacturing solutions have both the highest precision and speed AND lowest ‘complete cost of ownership' for microtechnology, allowing our customers to imagine, build and profitably deliver the technologies of the future. Founded in 1944, ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
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